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Nihon Superior to Launch New Advanced Pastes at INTERNEPCON Japan
OSAKA, JAPAN Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announced that it will exhibit in EAST 3-27 at the upcoming INTERNEPCON 2014, scheduled to take place January 15-17, 2014 at the TOKYO BIG SITE in Tokyo, Japan.

The following products will be on display in the booth:

SN100C P506 D4 is a lead-free (Sn-Cu-Ni-Ge) no-clean solder paste that can be stored at room temperature for more than 60 days without deterioration. This new material will not only simplify stock management, but also improve productivity with excellent consecutive printability.

Alconano Nano-Silver Paste is based on a patented technology that makes it possible to effectively join most metals as well as Si and SiC at low sintering temperatures, if necessary in nitrogen, without the nitrous or sulphurous residues that are the by-products of the sintering of some other nano-silver pastes. The highly active surface of the nano-silver particles and the consequent strong capillary forces makes it possible to achieve strong bonds with high electrical and thermal conductivity at low temperature without the need for external pressure.

SN100C P820 D5 is a lead-free (Sn-Cu-Ni-Ge) no-clean solder paste that can suppress the flux residue.

For more information, visit www.nihonsuperior.co.jp/english.

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