Tuesday, April 24, 2018
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GOEPEL Releases New Module Kit for parallel Test and Programming in Gang Applications
JENA, GERMANY - GOEPEL electronic has extended its SCANFLEX® Boundary Scan hardware product range by introducing the SFX Gang Test Module Kit as a new solution for parallel test and programming of up to 32 different assemblies with an integrated Mass Interconnect Interface from Virginia Panel. The kit, consisting of three basic modules, is an easy-to-integrate complete solution for parallel applications based on Embedded System Access (ESA) technologies providing throughput increase by factors of 16 or 32. As only one system controller is required, efficiency increases and investment costs are reduced. The module kit, particularly developed for gang applications, can be flexibly adjusted to various environments and different test and programming applications such as Flash programming, MCU programming or dynamic tests per Processor Emulation.

“Higher throughput and ideal integration are critical factors for the performance of modern test and programming solutions in production. Our new SCANFLEX module kits take account of these requirements“, says Bettina Richter, Marketing Manager with GOEPEL electronic. “The integrated Virginia Panel interface provides users numerous standardized fixture solutions for the fast and flexible configuration of individual gang testers.”

About the SFX Gang Test Module Kit
The SFX Gang Test Module Kit as a member of the SCANFLEX® hardware family is a complete solution for the parallel test or programming of up to 16 or 32 units. It consists of three interconnected module types – a TAP transceiver, a multipurpose parallel I/O unit, and a power management unit. For simple system integration, all modules have onboard Mass Interconnect Interfaces from Virginia Panel, and are controlled by a central controller.  

The Gang Test Module Kit supports all modern technologies for Embedded System Access (ESA). In addition to Boundary Scan, these are Processor Emulation and Chip embedded Instruments. These methods allow for design validation, hardware debugging, production test as well as Flash and PLD programming without probe or nail utilization (non-intrusive).

Each site can be individually programmed in several parameters (protocols, voltage, delays etc.). Moreover, an integrated power module guarantees a safe voltage supply incl. U/I monitoring of each site and controlled shutdown in fault cases. The onboard Mass Interconnect Interface from VPC is particularly advantageous, as standardized test fixture solutions are provided.

About Embedded System Access (ESA):
ESA technologies enable the electrical access to embedded systems without utilizing mechanical nails or probe contacts (non-invasive methods). They apply design-integrated test and debug interfaces such as JTAG. In addition to Boundary Scan, ESA technologies include procedures like Chip Embedded Instruments, Processor Emulation Test, In-system Programming or Core Assisted Programming. ESA technologies are currently the most modern strategies for validation, test and debug as well as programming complex chips, boards, and complete units. They can be utilized throughout the entire product life cycle, enabling improved test coverage at reduced costs.

Further information about the company and its products can be found on the internet at www.goepel.com.

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