New Albany, IN — Samtec's line of high-speed edge card solutions now includes a new high density edge card socket (BEC5C Series) with up to 140 total contacts on 0.50mm pitch. This micro card socket is especially suitable for high-speed applications requiring board space savings.
|High-density edge-card socket. |
The dual beam bi-level contact system is on a staggered 0.5mm pitch, which reduces card mating force without reducing reliability. This vertical socket is available for both 0.062-in. (1.60mm) and 0.093-in. (2.36mm) card thicknesses. Standard features include a lower cost phosphor bronze contact, weld tabs, alignment pins and lead-free solder crimp terminations for easy board processing. Tin-lead solder charges, as well as alternative platings and pin counts, are also available.
The company offers a complete line of high-speed edge card sockets in a variety of pitches from 0.50mm to 2mm. Orientations include vertical, right-angle and edge-mount designs to support high density, standard and specific application needs.
Samtec's Signal Integrity Group provides application support by its in-house Signal Integrity engineers for this edge card socket and many other products. These highly qualified engineers help with application-specific design, modeling and testing as well as interpretation of the test data and performance results.
Contact: Samtec, Inc., P.O. Box 1147, New Albany, IN 47151-1147 800-726-8329 or 812-944-6733 fax: 812-948-5047 E-mail: firstname.lastname@example.org Web: http://www.samtec.com