GREELEY, CO — FCT Assembly today announced that Field Application Engineer Tony Lentz will present at the upcoming SMTA Austin (CTEA) Expo & Tech Forum, scheduled to take place Thursday, December 5, 2013 at the Norris Conference Center in Austin, TX. Lentz will present “Can Nano Coatings Really Improve Stencil Performance?”
The trajectory of electronic design and its associated miniaturization shows no signs of altering course. Surface Mount Technology will require innovative materials and processes to stay in lockstep with other segments of the electronics industry. Nano coatings have been introduced by various manufacturers, with the promise of addressing some of the challenges relative to solder paste printing. With several nano technologies already on the market and more likely to be introduced, Lentz will address the following questions: How can the performance be quantified?; How robust are these coatings?; How can an assembler approach the ROI of these coatings?; and what hidden benefits or negative impacts should be considered?
Lentz has been in the electronics industry since 1994, and worked as a process engineer at a circuit board manufacturer for five years. He has extensive experience performing research and development, quality control, and technical service with products used to manufacture and assemble printed circuit boards. Additionally, Lentz has been involved with APEX for many years. He holds B.S. and M.B.S. degrees in chemistry.
For more information about FCT Assembly, visit www.fctassembly.com.