MUNICH, GERMANY ― Microtronic GmbH, a leading sales specialist of microelectronics, has entered into a strategic partnership with Loadpoint to offer a dicing and grinding service. Microtronic will offer this new dicing service via its facility in Munich to better service its European customers, providing shorter lead times and faster shipping. In addition to the dicing of silicon wafers and MEMS structures, Loadpoint’s expertise will be used to cut glass plates (with/without chrome masks), carbon products, PZT arrays for sonar and ultrasound applications, optical components, specialty metals for the electronics industry, FR4 boards, ceramic plates rods and profiles, and more. Ancillary services such as resin back filling of PZT arrays and component assembly also can be provided to customer requirements.
“We have been working with Loadpoint since before Microtronic was founded,” commented Ernst Eggelaar, President of Microtronic. “I am very excited to continue to grow our partnership with this new offering for our customers.”
Loadpoint develops, manufactures and supplies high-precision dicing machines and machining systems for semiconductors, photonics, MEMs, PZT & Piezo materials, specialist materials and related industries. Additionally, Loadpoint pioneered the first dicing saw designs for cutting semiconductors, which now are used worldwide. The company has the capability to cut wafers up to 300 mm diameter, substrates up to 450x300 mm and ceramics up to 50 mm thick. Loadpoint offers bespoke dicing saw designs to increase productivity for complex customer requirements and custom software interfaces for best ease-of-use. For more information about Loadpoint, visit http://www.loadpoint-dicing.com.
For more information about Microtronic’s products and services, visit www.microtronic.de.