Monday, September 26, 2016
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Hesse Mechatronics to Demonstrate Wedge Wire Bonding Capabilities at Productronica
FREMONT, CA – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, announces that Hesse GmbH will demonstrate a full range of wedge wire bonding capabilities at Productronica, taking place November 12-15 in Munich, Germany, in Hall B2, Booth 255.

Hesse Mechatronics will demonstrate:
  • Large diameter copper (Cu) heavy wire capability on the Bondjet BJ935 Fully Automatic Heavy Wire Bonder
  • Heavy wire bonder full automation capabilities on the Bondjet BJ935, featuring the only heavy wire bondhead with non-destructive pull test and a unique transducer integrated sensor for 100% quality monitoring in real-time
  • Lead frame indexing on the Bondjet BJ931 High Speed Fully Automatic Dual-Head Wedge Bonder, meeting the latest technology and flexibility demands for automotive and power electronics applications, handling thin and heavy aluminum, copper and gold wire and ribbon on two specialized bond heads that can be changed out in minutes
  • The industry standard for thin wire wedge bonding speed and accuracy with the Bondjet BJ820 High Speed Fully Automatic Fine WireWedge Bonder, offering speed of up to 7 wires/sec., accuracy of 1 μm at 3 σ axis repeatability, in addition to the largest work area For more information on Hesse Mechatronics and its family of wedge bonders, please visit the company’s website at www.hesse-mechatronics.com. 

For more information on Hesse Mechatronics’ training and applications support services in the Americas and to see wire bonding in action, please visit www.wirebonddemo.com or e-mail info@hesse-mechatronics.us.

About Hesse GmbH
World leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, Hesse GmbH is a privately held company that designs and manufactures thin wire wedge bonders for aluminum and gold, and heavy wire wedge bonders for aluminum, gold and copper, round wire and ribbon, including HCR™ (High Current Ribbon).

About Hesse Mechatronics, Inc.
Hesse Mechatronics is the Americas subsidiary of Hesse GmbH, providing sales and support for Hesse Mechatronics wedge wire bonding equipment in the United States, Canada, Mexico and Central and South America. The company also provides wire bonding equipment training, applications support, development and production of prototypes and pre-production manufacturing in four applications and demonstration labs throughout the USA.

For more information, please visit the company’s website at www.hesse-mechatronics.com.

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