Friday, June 22, 2018
Home/Current Issue >  Daily News Archive > 

Machine Vision Products Demonstrates Diverse Inspection Toolbox for Microelectronics and Packaging on the Ultra 850G AOI at Productronica 2013

CARLSBAD, CA Machine Vision Products today announced it would be demonstrating its 850G inspection solutions at the Productronica 2013 exhibition. The exhibition is at Messe München in Munich from November 12th to 15th 2013. Machine Vision Products are exhibiting on Booth 220 in Hall A2.

The MVP 850G’s diverse inspection toolbox provides the highest quality inspection capabilities for multiple locations in microelectronics and packaging lines.

For Lead Frame processes the 850G can be placed Post Die Bonder, Post Wire Bonder or Post Solder Ball Attach. In addition the system provides capability to inspect Au, Al, Ag, and Cu wires at resolutions down to 1um. 

The 850G provides full inspection for post die-bonder and post ball-bonder processes, at UPH’s that meet device cycle times. In the same inspection, the system also delivers full bond layer, die surface, die position, edge and substrate inspection. 

Within Flip Chip processes the 850G can be positioned Post Wafer Bumping, Post Die Placement, Post Underfill and Post Final Packaging.

The 850G can be configured for Lot Solutions including Magazine Lifters/Indexers, Jedec Trays, Waffle Packs, and Auer Boats. MVP’s inline solutions allow for both single and dual lane processing, strip handling and in-line wafer handing. In addition MVP also provides custom handling solutions.

With specialized material handling and tools MVP can typically inspect with a UPH reaching up to 25000 depending on the density of the components in a lead frame strip. The high speed, high inspection quality solution provided by MVP puts it as a leader in these markets, that was, until recently, very dependent on manual inspection.

The 850G integrates MVP’s easy-to-use programming tools and analytical process control tools. This convergence of technology from MVP delivers the best available combination of defect detection capabilities, metrology, process control and speed at a low cost of ownership.

MVP continues to  develop all of their product offerings. This provides a much better cost structure to the end user. Additionally, because all development is performed in-house, the support structure is more efficient. With over 20 years of leadership, MVP is taking multiple steps to continue to provide the overall lowest cost of ownership when compare to any competitor globally.

For additional information on this unique solution, please visit  or  Booth 220, Hall A2 at Productronica 2013.


CONTACT: Email:        Phone: +1-760-438-1138

search login