Wednesday, June 20, 2018
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DuPont and IQLP Ink Deal to Develop High-Speed Circuit Technology
Research Triangle Park, NC — DuPont Circuit & Packaging Materials (DuPont) and IQLP, LLC, a division of Interplex Industries, Inc., are involved in ongoing efforts to further develop and refine liquid crystal polymer (LCP) thin-film technology for use in high-speed circuit applications. The development efforts are being conducted pursuant to a joint development agreement and a license agreement previously entered into by the parties.

Following the completion of successful development efforts, it is anticipated that the technology will be utilized in the development and commercialization by DuPont of products for use in the production of circuits for applications such as smart phones, telecom, internet infrastructure, high-speed computing and radar sensing devices. Potential products that DuPont may develop which incorporate LCP thin-film technology may include double-sided copper clad laminates, along with LCP bond ply materials for use in fabricating multilayer circuit boards. Successful development and commercialization of products that incorporate LCP thin-film technology would allow DuPont to provide a wider range of products in the high-frequency laminate marketplace.

Contact: DuPont Circuit & Packaging Materials, 14TW Alexander Drive, Research Triangle Park, NC 27709 800-243-2143 fax: 570-268-3699 Web:

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