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ARCHIVE >  October 2013 Issue >  Electronic Mfg. Products > 

New Low Resistance Fujipoly TIM
Thermally conductive material under IC provides heat management.
Carteret, NJ — New from Fujipoly is its Sarcon® GR45A-00, a very low modulus thermal interface material (TIM) with a low thermal resistance. This new formulation completely fills air gaps between components, board protrusions and recessed areas while exhibiting very low pressure. This allows greater surface contact with a heatsink and improves cooling performance.

When placed between a heat source such as a semiconductor and a nearby heat sink, this TIM provides a thermal conductivity of 6.0W/m°K per ASTM D2326 (4.5W/m°K per ISO/CD 22007-2 Hot disk) and a thermal resistance as low as 1.33°C/cm2/W. The material is available in convenient pre-cut sheets up to a maximum size of 200 x 300mm (max.) and can also be die cut to exact application specifications. Material thicknesses from 0.5 to 5.0mm can be specified in 0.5mm increments.


Contact: Fujipoly America Corp., PO Box 119, Carteret, NJ 07008-0119 732-969-0100 fax: 732-969-3311 E-mail: info@fujipoly.com Web:
http://www.fujipoly.com

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