Delaware, OH — Engineered Material Systems is introducing its CA-195 High Thermal Conductivity, Low Cost Electrically Conductive LED Die Attach Adhesive for attaching LEDs and other small semiconductor die to silver and copper lead frames.
|High thermal conductivity adhesive helps dissipate heat. |
The new adhesive is approximately half the cost of a pure silver-filled die attach adhesive, has a high glass transition temperature (Tg) to facilitate wire bonding small die, low extractable ionics and high adhesion to silver and copper lead frames.
CA-195 has a dispense open time greater than 24 hours (measured as a 25 percent increase in viscosity), while maintaining optimized rheology for pin transfer or needle dispensing. The adhesive is suitable for small die thermal management applications.
The product is the latest addition to the company's extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.
Contact: Engineered Materials Systems, Inc., 132 Johnson Dr., Delaware, OH 43015 740-362-4444 fax: 740-362-4433 Web: http://www.emsadhesives.com