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Special Features: SMT and Assembly
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October 2013 Issue
Special Features: SMT and Assembly
Evaluate Soldering in a Nitrogen Atmosphere
By Heike Schlessmann, Marketing Manager, and Dr. Ronny Horn, SEHO Systems GmbH, Kreuzwertheim, Germany
Soldering in a nitrogen atmosphere can improve solder joint quality and manufacturing yields. Performing circuit assembly in an inert gas atmosphere offers many benefits, especially for lead-free products assembled under high process temperatures, where oxidation and contamination of ...
JTAG/Boundary Scan Makes Dependable Test Connections
Mario Berger and Enrico Lusky, Sales Engineers, Goepel electronic GmbH, Jena, Germany.
Shrinking, densely populated printed-circuit boards (PCBs) and electronic assemblies make efficient electronic testing of electronic products ever more challenging. Compact assemblies and components create serious issues in terms of mechanical test-point access when it is time to develop ...
Methodology Helps Detect Counterfeit Components
By David Bernard, Dage Precision Industries
Counterfeit components are now a real concern in electronics assembly, not just for expensive items but more and more for lower-costing components. Many involved in PCB assembly will admit to having received counterfeit components in the past, and/or know someone who has. A counterfeit ...
Optimizing OEE: A Key to Successful Onshoring
By Jeff Zopff, Global Marketing Communications Manager, Universal Instruments Corporation, Conklin, NY
Electronics manufacturing production is returning to American shores. Moving production to China or other offshore locations is no longer as attractive now as it was a decade earlier, with labor rates climbing and manufacturers gaining a clearer understanding of hidden costs connected ...
Setting Test Straight With A Novel Fixture Solution
By Staff of Everett Charles Technologies, Pomona, CA
In-circuit-test (ICT) fixtures have been a cornerstone of electrical testing for the past several decades. However, there have been few, if any, significant advances in this field over the past 20 years. ICT fixtures have steadily become more complex, which in turn increases the turnaround ...
Understencil Wipe Cleaning Yields Improvements
By Mike Bixenman, D.B.A., Kyzen, Nashville, TN, and Chrys Shea, Chrys Shea Engineering Services, Burlington, NJ, and Ray Whittier, Vicor Corporation - VI Chip Division, Andover, MA, and Brook Sandy-Smith, Indium Corporation
Understencil wiping has gained growing interest over the last several years. Due to the use of ever smaller components and increasingly dense interconnections in the design of printed-circuit boards (PCBs), stencil cleanliness is more important than ever, both inside the aperture wall ...
Why Automatic Thermal Profiling Outperforms Manual Approaches
By Bjorn Dahle, President, KIC, San Diego, CA
Electronics manufacturers are constantly seeking improved performance for reduced cost. As part of electronic manufacturing, one of the last manual tasks to make the transition to automation is thermal profiling. Yet, the technology for real-time thermal automatic profiling (AP) certainly ...
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