Wednesday, June 20, 2018
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Engineered Material Systems Releases New Conductive Adhesive for Solder Replacement Applications

DELAWARE, OHEngineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, debuts its CA-102 Conductive Adhesive designed for bonding components to circuit boards.

CA-102 has a moderate glass transition temperature (Tg) and modulus. The adhesive has an optimized rheology for screen printing and can be needle dispensed by time-pressure, auger or positive displacement. CA-102 is modified to provide conductivity stability during damp heat testing on tin, silver and copper surfaces. CA-102 is ideal for applications requiring lower stress, lower temperature processing or elimination of Pb in solder.

CA-102 is the latest addition to Engineered Material Systems’ extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.

For more information about the CA-102 Electrically Conductive Adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit

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