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Indium Corporation Features High-Reliability Gold-Based Solders at IMAPS

CLINTON, NY - Indium Corporation will feature high-reliability gold-based solders at the International Symposium on Microelectronics International Symposium on Microelectronics (IMAPS) September 30 – October 3 in Orlando, Florida.

Gold-based solders provide superior thermal fatigue resistance, resistance to corrosion, and the highest tensile strength of any solder. They also have high melting points that are compatible with subsequent reflow processes.

Gold-based solders are ideal for use in high-reliability applications, such as medical products, aerospace, defense, package sealing, optics, and specialty MEMS packaging. They can be used in a variety of soldering applications, including vacuum solder, die-attach, laser soldering, vapor phase reflow, and manual soldering.

RoHS-compliant gold-based solders come in several forms, including preforms, ribbon, wire, paste, and spheres.

Additionally, Indium Corporation has some of the most experienced and knowledgeable technical support engineers in the industry. These engineers are available to work with you to support material evaluation, process upgrade, or new product introduction.

Indium Corporation will be exhibiting in booth 409.

For more information about gold-based alloys, visit www.indium.com/gold or email gold@indium.com.

 
 
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