PHILADELPHIA, PA - ACI Technologies of Philadelphia PA will host free equipment demonstrations and a seminar featuring Stencil printing experts from MPM Speedline, 3D solder paste inspection by Koh Young, Pick and Place Technology with Juki, and profiling experts from BTU International. For convenience, the same seminar will be held on two days, October 2nd and October 3rd. All equipment will be operating. Problem jobs invited.
MPM and Koh Young will present the co-development of a closed-loop communications link between the stencil printer and a Koh Young Solder Paste Inspection (SPI) system that allows the two to automatically work together to optimize the solder paste printing process.
Koh Young: Excellent reliability and zero rework start with the measurement of solder paste on the PCB board. Solder paste Inspection takes the guess work out of achieving reliability and zero rework can be achieved by providing 3 Dimensional measurement of solder paste volume.
Juki : Chip placement machines pace the speed of the Production line. Entry level machines and older generation units can’t hold modern tolerances.The manufacturing experts from Juki will describe challenges of the modern SMT environment and discuss solutions. POP will also be discussed.
BTU : Mastering the solder paste reflow profile is usually the last step to locking down the SMT assembly. An expert from BTU on developing reflow profiles will present.
MPM Speedline : Stencil printing experts from MPM will describe the best techniques to assure excellent registration, paste geometry, and volume in the stencil printing operation.
Date: For your convenience the identical workshop will be offered on two separate dates, October 2, and October 3. Starting at 8:30 AM.
RSVP: Katie Riggan by phone at 610-362-1200, extension 250 or via Email at firstname.lastname@example.org