Sunday, January 22, 2017
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SSEC Intros Single Wafer Wet Processing Solutions
Horsham, PA — Solid State Equipment LLC (DBA SSEC), a provider of single wafer wet processing systems used in the manufacture of semiconductor devices, high-brightness LEDs, and hard disc drives, has introduced its WaferEtch and WaferStorm product lines.

The WaferEtch platform is an aqueous-based, customizable platform configured to meet the needs of specific etch applications for 3D ICs, MEMS, and compound semiconductor processes. These systems use a wet etch process chemistry that demonstrates optimal etch rate and in situ cleaning.

The flagship of the WaferEtch platform, the TSV Revealer, is specifically configured to address the requirements of TSV reveal, which is the process where the backside of the wafer is thinned to reveal the copper interconnects. It has become a target area in the manufacture of 2.5D and 3D IC packaging for process control and cost reduction. The product replaces three tools required for the dry etch approach: plasma etch, silicon thickness measurement, and clean. An optical end point detection system with advanced algorithms determines when vias are revealed. Integration of a wafer thickness measurement sensor in the etch system provides closed-loop control of the etching process.

The WaferStorm platform is a solvent-based platform, initially available in three unique configurations: TSV Cleaner, Metal Lifter, and Dry Film Remover. All WaferStorm systems are based on the company's special soak and spray technology, which provides improved performance at lower cost than conventional wet bench-only or spray-only approaches. The process combines equal soak time in the wet buffer tank for each wafer, followed by spray, and then a final step depending on the process being performed. This unique combination minimizes both spray time and chemistry use, and adds a significant level of process control. The reduction in spray time results in increased throughput.

TSV clean is a critical process step that is essential to reliability. The deep reactive ion etch (DRIE) process leaves behind a polymer residue which can lead to defects and voids in the barrier, seed, and fill steps that follow. SSEC's WaferStorm TSV CLEANER is proven to remove residues in high-aspect-ratio holes that wet bench-only or spray-only tools leave behind. The tool features equal-time soak software for process control.

Contact: Solid State Equipment, LLC, 185 Gibraltar Road, Horsham, PA 19044 215-328-0700 fax: 215-328-9410 E-mail: Web:

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