HIGH WYCOMBE, BUCKS, UK — SMART Group, Europe’s largest technical trade association focusing on surface mount and related technologies, announces that its annual SMART Group European Conference & Table Top Exhibition will be held from 2-3 October 2013 at the Spread Eagle Hotel in Cornmarket Thame, Oxfordshire, England.
In true SMART Group form, the conference will focus on real-life issues, providing speakers that are both experienced and innovative enough to answer all the questions that most plague companies today. The team of speakers comes from respected organisations and combines to give a global overview of alloy use and soldering methods as well as key areas of solder alloy choice, including lead-free, SAC and high tins; methods for choosing lead-free alloys; quality/cost considerations; educating the industry to repatriate business and stay competitive; and the importance of compliance and how to stay updated.
Key speakers on these alloy selection topics include:
- Dominic Lodge, Solders Technology Manager, Soldertec at ITRI Ltd. : Dominic has worked with the Institute for Materials, Minerals and Mining, the International Tin Research Institute (ITRI), and Cookson Electronics. He has developed low-Ag solders and run qualification programs for major OEMs. Dominic rejoined ITRI to manage the Solder Technology Division.
- Keith Sweatman, Senior Technical Advisor at Nihon Superior Co. Ltd.: Keith brings 40 years of solid experience in soldering technology. He has worked at ITRI and Multicore Solders, and is now with Nihon Superior Co., Ltd., coupling a scientific basis for solder alloy development with his experience through a series of collaborative ventures with global academia.
Richard Boyle, Global Product Champion, Solder Material Range at Henkel: Richard began his career at Multicore solders and then Henkel. He concentrates on real-world applications and solutions, interfacing with customers and professional associations and institutions globally.