Monday, May 21, 2018
Archive >  September 2013 Issue >  Electronic Mfg. Products > 

Low Viscosity Epoxy from Master Bond
Potting and encapsulating compound.
Hackensack, NJ — Suitable for large castings, Master Bond EP21LVSP6 combines a low viscosity and low exotherm with a working life of 3-5 hours. It can also be used for bonding, sealing and coating applications in aerospace, electronic, electrical, optical and other specialty industries.

This two-part epoxy offers a non-critical one-to-one mix ratio, by weight or volume and its processing is facilitated with color coding: Part A is clear and Part B is amber clear. It is formulated to cure at room temperature or more rapidly at elevated temperatures.

EP21LVSP6 bonds well to a variety of similar and dissimilar substrates such as metals, composites, glass, ceramics, rubbers and plastics. It has a tensile strength exceeding 7,000 psi and a tensile lap shear strength greater than 2,500 psi. The system is able to withstand chemicals including water, oil, fuel, acids and bases. It is a competent electrical insulator over the temperature range of -60 to +250°F (-51 to +121°C). The epoxy is available in a variety of packing options, including 1/2 pint, pint, quart, gallon and 5 gallon kits (0.2365, 0.473, 0.9463, 3.785, and 19.927 liter) as well as a gun dispenser.

Formulated for potting and encapsulation, the new compound is particularly suited for larger castings. It provides low exotherm, good flow and a long working life.

Contact: Master Bond, Inc., 154 Hobart Street, Hackensack, NJ 07601-3922 201-343-8983 fax: 201-343-2132 E-mail: Web:

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