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Archive >  September 2013 Issue >  Front Page News > 

ASM/SIPLACE Gets New Presence in Silicon Valley


ASM Assembly Systems (SIPLACE) has started a new chapter in its book of electronics growth with the official opening of its West Coast Technical Center at new partner Technica USA's facilities in San Jose, California. Technica came on board as the SIPLACE rep organization for Northern ...

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Standards Can Boost Business in The Global Marketplace


As business managers for electronic firms across America seek sustainable economic growth for their companies and for this country, they are becoming more aware of a powerful business tool that can help drive growth. It is a tool that can tap into new and expanding technologies, can help cut costs ...

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Atomic Clock Simulates Quantum Magnetism

Boulder, CO — Researchers at JILA have for the first time used an atomic clock as a quantum simulator, mimicking the behavior of a different, more complex quantum system. (M.J. Martin, M. Bishof, M.D. Swallows, X. Zhang, C. Benko, J. von-Stecher, A.V. Gorshkov, A.M. Rey and J. Ye. "A quantum many-body spin ...
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SEMICON WEST Adds WT | Wearable Technologies Conference Co-Location: Premier U.S. electronics manufacturing event expands with wearables program
MILPITAS, CA - SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco.         
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.        
Atotech to present Spherolyte® CU UF3 for fine line RDL at ECTC 2018
BERLIN, GERMANY - Atotech is pleased to announce its partaking in the Electronics Components and Technology Conference (ECTC) 2018. As a gold sponsor, Atotech will participate with two presentations and a booth, highlighting its latest solutions for flexible electronics as well as fan-out wafer-level and fan-out panel-level packaging.    
 
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