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Advanced 3-D SPI from ASC Showcased in Three Stands at NEPCON South China

MEDINA, MINNESOTA  ― ASC International, a leading manufacturer of 3-D solder paste inspection and automated optical inspection (AOI) systems, has announced that it will be represented in three stands during NEPCON South China 2013, scheduled to take place August 27-29, 2013 at the Shenzhen Convention & Exhibition Center in China. Kasion Automation Limited (Stand A-1K30) will showcase the VisionPro AP500 and both Protec and Smartop (Stand A-6A21) will demonstrate the VisionPro M500.

The VisionPro AP500 SPI system incorporates the most advanced, rapid 3-D inspection technology within a stylish vibration-free, fully automated platform. Designed with feature-rich software including onboard real-time SPC run charts, customized data reports and simple-to-use GerberProTM conversion programming software make the VisionPro AP500 the most desired offline SPI solution around the globe.

The VisionPro M500 SPI system incorporates the most advanced, rapid 3-D inspection technology coupled with an intuitive Windows® XP Pro / Windows 7 OS and packaged in a rugged, bench-top platform.  Utilizing the completely automatic measurement mode, errors associated with manual measurement subjectivity are eliminated, making the VisionPro M500 an exceptional value for electronics manufacturers concerned with improving production yields. Designed with feature-rich software, including onboard real-time SPC run charts, customized data reports and simple-to-use GerberProTM conversion programming software, the VisionPro M500 is the most desired offline SPI solution around the globe.

For more information about ASC International, visit www.ascinternational.com.

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