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Archive >  August 2013 Issue >  Electronic Mfg. Products > 

EMS Intros New Wire Bond Encapsulant and Adhesive
New adhesive/encapsulant available in many sizes.
Delaware, OH — Engineered Material Systems has introduced its 357-284 Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive for printer head and circuit assembly applications.

This new encapsulant/adhesive is designed to protect wire bonds and reduce stresses associated with thermal cycling. The material has excellent chemical resistance to inks.

The 357-284 adhesive/encapsulant has very high fracture toughness and adhesion to flexible circuits, FR4 and metal substrates. It meets circuit assembly and semiconductor standards for ionic cleanliness (extractable ions) to prevent corrosion in high temperature and humidity environments.

Contact: Engineered Materials Systems, Inc., 132 Johnson Dr., Delaware, OH 43015 740-362-4444 fax: 740-362-4433 Web:

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