||Bangalore, India — IPC — Association Connecting Electronics Industries® will host IPC APEX India on August 26-29, 2013 at the NIMHANS Convention Centre in Bangalore, India. A global leader among standards-developing organizations in electronics manufacturing, IPC brings its technical expertise to provide a pathway for growth to manufacturers in India. IPC APEX India will offer professional development workshops on August 26-29, as well as a technical conference and exhibition on August 27-29.
The IPC APEX India technical conference includes paper presentations that reveal new research and innovations in the electronics manufacturing industry. Attendees will have the opportunity to interact with the experts who are charting the course for tomorrow's technology.
The three-day technical conference kicks off on Tuesday, August 27, with two sessions on counterfeiting: "Counterfeiting and Semiconductor Value Chain Economics," by Rory King of IHS Inc., and "Electronics Engineering Management — Counterfeit Electronics Components," by Seema Sabikhi of Barco Electronic Systems (P) Ltd. Focusing on advancements in design, Chandrakanth Gajawada of Sienna ECAD Technologies will discuss "Design for Assembly (DFA) Analysis," and Mr. Giridharan and Ugra Mohan Roy, SAP AG, will present "Design and Development of Cost-Effective General Purpose FPGA Board." The Tuesday sessions end with "TMV PoP (0.4/0.4mm Pitch) Assembly and Design Challenges," by Ranilo Aranda of Flextronics Manufacturing (Zhuhai) Co. Ltd.
On Wednesday, August 28, more presentations on industry innovations begin with "Developments in Advanced Packaging," by TechSearch International's Dr. Timothy G. Lenihan, followed by "SMT Reflow Profile Optimization in the Challenging Lead-Free World," by Liyakathali K. of Indium Corporation. Other presentations include: "Alcohol-Passivated Nano-Silver Paste for Electronic Assembly," by Wayne Ng of Nihon Superior Trading (S) Pte. Ltd.; "Alternative Alloys Rev TC," by T.S. Lim of AIM Solder; "Low-Temperature SMT Process Implementation," by Richard Puthota of Alpha Alent; and "Processes in the Area of Reliability and Quality Assurance, Environmental and ESD Compliance," by SAP Labs India Private Ltd.'s Rajeev Deshpande. The day will conclude with "A Practical Approach to Assessing Human Body Electrostatic Discharge Potential," by K. Rajkiran and C.S. Sudheendranath of Cir-Q-Tech Tako Technologies Pvt. Ltd.
The final day of the conference will take place on Thursday, August 29, with must-attend presentations, including "Reliability & Quality Assurance — Manufacturing Quality Control," by Irene Lim, ASM Assembly Systems Singapore Pte. Ltd.; "BGA Detachment — Failure Analysis," by S. Anandha Sowmya, Avalon Technologies Pvt. Ltd.; and "Design Reliability Assessment and Improvement Through Accelerated Reliability," by Shaik Hussain Basha, Crompton Greaves Ltd.
IPC APEX India will present the latest innovations from some of the world's leading companies in the areas of printed board design and manufacturing, electronics assembly and test. During the next decade, the electronics products industry in India is projected to grow substantially, and IPC APEX India will show attendees how to grow with it.
Comprehensive Workshop Program
APEX India will also offer a comprehensive program of both half- and full-day workshops designed to help engineers find solutions to their most pressing concerns in electronics manufacturing. Led by knowledgeable, well-known instructors, the professional development workshops will take place Monday August 26 through Thursday August 29.
On Monday, August 26, three full-day workshops will provide process and design engineers with insights from top industry experts. IPC Hall of Famer Ray Prasad of Ray Prasad Consultancy Group will present, "Four P's of SMT in a Lead-Free World: Principles, Practices, Promises and Problems." Discussing key issues for EMI/EMC, Robert Hanson of Americom Seminars will provide guidance on how to design and build a compliant system. The third workshop will cover "Signal and Power Integrity Challenges in PCB Design" by Narasimha S. L. Murthy of ASM Technologies Ltd. Bangalore.
Prasad and Hanson return on the afternoon of Tuesday, August 27, with two half-day workshops, "Design and Assembly Process Challenges for Bottom Terminations Components (BTCs): QFN, DFN and MLF in a Tin-lead & Lead-free World," and "Vias and Their Effects on High-speed Digital Signals," respectively.
Wednesday, August 28 will see a range of workshops: the full-day "Failure Analysis for Improved Reliability" will be presented by Bhanu Sood of Test Services and Failure Analysis at CALCE, University of Maryland. In addition, four half-day sessions will be offered. In the morning, Prasad will discuss "Ball Grid Array: Principles and Practice" and Hanson will present "ABCs of Grounding: Analog/Digital Planes." In the afternoon, Prasad will present "Troubleshooting Yield Problems in a Lead-free World" and Hanson will focus on "Differential Signaling — Tradeoffs for Optimization of Signal Quality and Routing."
On the final day of the event, Thursday, August 29, three half-day workshops will be offered in the morning: "Design for
Manufacturability (DfM) in a Lead-free World" by Prasad; "Designing the Interface for DDR 3/4 and PCle 3/4 Buses," by Hanson; and "Latest Tools and Techniques for Counterfeit Parts Identification and Mitigation," by Sood.
Contact: Web: http://www.ipcapexindia.in or http://www.ipc.org