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Archive >  August 2013 Issue >  Front Page News > 

Closing in on Fuel Cell Autos


San Francisco, CA — Fuel cells are not only alive and well, they're getting closer to general use, according to Juan Contreras, a spokesman for the California Fuel Cell Partnership. Holding forth at a display just outside the entrance to the North Hall at Semicon West, Contreras ...

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Dow Corning: Collaboration Critical to Semicon Recovery

San Francisco, CA — Semiconductor sales appear to be finally emerging from the red this year, with moderate but steady growth of 5.1 percent projected through 2014, according to World Semiconductor Trade Statistics' Spring 2013 global semiconductor sales forecast. While a revival in end-market demand is sparking ...
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Sandia to Help Gird Grid Against Future Outages

Hoboken, NJ — Some special help is coming from Sandia for East Coast communities devastated by Hurricane Sandy. The object is to boost the resiliency of their electric grids, so they can be better prepared to deal with natural disasters in the future.
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Indium Corporation to Feature AuSn Solder Preforms at International Microwave Symposium
CLINTON, NY - Indium Corporation will feature its precision AuSn solder preforms at International Microwave Symposium (IMS) 2018 from June 10-15 in Philadelphia, Penn.

Indium Corporation’s AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability for joining and sealing.         

SEMICON WEST Adds WT | Wearable Technologies Conference Co-Location: Premier U.S. electronics manufacturing event expands with wearables program
MILPITAS, CA - SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco.         
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.        
 
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