Friday, October 20, 2017
Home/Current Issue >  Industry Articles >  Test and Measurement > 

Underfilling Flip-Chip Die Using Continuous-Path Motion Control

Flip-chip devices have been important components in electronic circuits for some time, with underfill technology helping to minimize thermal stress between flip chips and the substrates on which they are mounted. The process of adding underfill materials to flip chips and other miniature ...
search login