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SEHO Announces Selective Soldering Seminar

SEHO North America, Inc. announces a Selective Soldering Seminar from the SEHO Academy, scheduled to take place in Cincinnati, Ohio, on Thursday, September 19, 2013. As part of the successful SEHO Academy with more than 1,000 satisfied attendees worldwide, this seminar will help increase the quality level of the production process and decrease manufacturing costs. As a result, participants will realize a higher level of profitability. SEHO’s training concept is based on a balance of classroom learning and hands-on training.

The one-day seminar will focus on the importance of precision in the selective soldering process, with the resulting demand for process optimization to improve both quality and cycle time.  The seminar will provide detailed theoretical background knowledge including process teaching parameters and lead-free selective soldering. Additionally, typical issues in the selective soldering process will be discussed, such as poor hole fill, solder bridging and solder balling, basic rules for board design to avoid difficulties in the production process as well as process-related soldering defects and corrective measures.

The seminar will be supplemented by a lecture presented by John Borneman, Soldering Technology Leader at Delphi Electronics and Safety in Kokomo, IN. John Borneman has been working in electronics manufacturing engineering for more than 30 years in the areas of component assembly and soldering. He provides outstanding experience and knowledge, and holds a Six Sigma Master Black Belt Certification.

Intensive maintenance and hands-on training will take place at the demo facilities of SEHO North America, Inc. during the afternoon. This practical portion of the seminar will focus on SEHO’s PowerSelective.

For more information about SEHO, visit



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