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Tresky to Display T-6000 Die Bonder at SEMICON West 2013
SWITZERLAND  
Tresky, a worldwide manufacturer of micro-assembly and rework applications, announces that it will display the T-6000 Flexible Automatic Die Bonder in Booth #5770 at the 2013 SEMICON West exhibition & conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA. Tresky will co-exhibit with XYZTEC.

The T-6000 Die Bonder is an all-purpose system for R&D, pilot and medium-size production.
Die handling is standard from wafer, waffle-pack and gel-pack. Automatic die assembly using pattern recognition is combined with ease of use operation and suited for manual single die placement.

The fully automatic T-6000 offers automatic placement with PRS with the possibility of the manual assembly, without complex programming. The many existing options — such as the wafer table for up to 8" wafer, die flipper, stamp unit and the best heating systems for eutectic and thermo-compression applications — also are compatible with the T-6000.

For more information, stop by Booth #5770 or visit www.tresky.com.

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