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Carteret, NJ — Fujipoly has introduced Sarcon® GR25A-00-50GY, an extremely soft thermal gap filler pad that also exhibits a very low thermal resistance. This thermally conductive silicone-based material easily conforms to most component shapes and board protrusions while exhibiting very low pressure.
When placed between a heat source such as a semiconductor and a nearby heat sink, this 0.5mm thick TIM provides a thermal conductivity of 2.50W/m°K and a thermal resistance as low as 0.18°Cin2/W. Sarcon GR25A-00-50GY is available in convenient pre-cut sheets up to a maximum size of 200 x 300mm and can also be die cut to exact application specifications.
Contact: Fujipoly America Corp., PO Box 119, Carteret, NJ 07008-0119  732-969-0100 fax: 732-969-3311 E-mail: info@fujipoly.com Web: http://www.fujipoly.com
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