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Hesse Mechatronics Launches Heavy Wire Bonding Services
Wire bonding.
Fremont, CA — Hesse Mechatronics, Inc. (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, will offer application development, prototyping and pre-production services on a newly installed BONDJET BJ939 Fully Automatic Heavy Wire Bonder at the company's west coast demonstration and applications lab, located at long-time company manufacturer's representative Chalman Technologies in Anaheim, California.

The company will also offer expanded services for heavy wire and ribbon in addition to thin wire applications at its demonstration labs in Tempe, Arizona and Clinton, Massachusetts.

The BONDJET BJ939 heavy wire bonder is suitable for power electronics and automotive device applications. Key features and specifications include: uses aluminum, gold, silver and copper round or ribbon wire; 3 mil to 20 mil wire; 0.075 x 0.75mm to 0.3 x 2mm ribbon on the same machine; places up to 3 wires/sec; integrated pull test; large table travel; E-Box optical tool adjustment; PiQC Process-integrated Quality Control measures true bond quality in real time; in-air cut feature eliminates marking on die In addition to providing demonstrations to customers, the company will offer early stage product development services on the BONDJET BJ939, including: heavy wire and ribbon bonding process support; development and production of prototypes; pre-production manufacturing.

Contact: Hesse Mechatronics, Inc., 225 Hammond Avenue, Fremont, CA 94539 408-436-9300 fax: 408-436-2822 E-Mail: info@hesse-mechatronics.us Web:
http://www.hesse-knipps.us Hesse Mechatronics lab: Chalman Technologies, 3150 E. La Palma Avenue, Suite K, Anaheim, CA 92806 714-632-1724

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