||Research Triangle Park, NC — The 46th International Symposium on Microelectronics will be held Oct. 1-3 at the Rosen Centre Hotel in Orlando, Florida, and is being organized by the International Microelectronics And Packaging Society (IMAPS). The IMAPS Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The 46th Symposium on Microelectronics will cover three tiers of electronics: Systems and Applications; Design and related measurements; and Materials, Process and Reliability.
IMAPS 2013 will have 5-6 technical tracks that span the two and a half days of sessions on: interposers and 2.5/3D packaging; modeling, design, test and reliability; materials and processes; advanced packaging and assembly; advanced and emerging technologies; and special sessions on packaging and system-integration, as well as an Interactive Student Poster Session.
Contact: IMAPS, 100 Park Drive, Suite 102, P.O. Box 110127, Research Triangle Park, NC 27709-0165 919-293-5000 fax: 919-287-2339