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Advanced Packaging Technology at SEMICON West
San Jose, CA — SEMICON West is scheduled for July 9-11, 2013 at San Francisco's Moscone Center. The dramatic changes in today's advanced packaging technology are required to meet the needs of newer and newer smart phones and new sensor technologies. These changes that demand continued improvements in form and function are being addressed by a number of programs on new packaging technologies and processes with speakers from leading chip makers, equipment manufacturers, and material suppliers.

IDC has forecast that semiconductor revenues will log a compound annual growth rate (CAGR) of 4.1 percent from 2011-2016, but revenues for 4G phones will experience annual growth over 100 percent for the same period. NanoMarkets estimates that the global market for "Internet of Things" sensors will reach $1.6 billion this year and grow to a value of $17.6 billion by the end of the decade as sensors become increasingly connected to the Internet directly or through hubs. Both trends will significantly impact semiconductor and microelectronics packaging. Demand for equipment and related tools in the 3D-IC and wafer-level packaging area alone is forecasted to grow from approximately $370 million in 2010 to over $2.5 billion by 2016 according to Yole Developpment.

To address these changes, a number of programs on new packaging applications, requirements, technologies, and products:

"Generation Mobile": Enabled by IC Packaging Technologies — Speakers from ASE, UBM Tech Insights, Amkor Technology, SK Hynix, and Universal Scientific Industrial will present on the latest advances in wafer level packaging, new materials, and multi-die integration, including new System-in-Package (SiP) and Package-on-Package (PoP) methods. Location:Moscone Center, North Hall, TechXPOT North, Tuesday, July 9, 10:30am-12:30pm.

"Thin Is In": Thin Chip and Packaging Technologies as Enablers for Innovations in the Mobility Era — IEEE/CPMT will hold a technical workshop on the overall trend of maximum functional integration in the smallest and thinnest package with lowest packaging costs with speakers from Intel, Cisco, ASE, Micron, SK Hynix, Nanium, Kyocera and more. Location: San Francisco Marriott Marquis, Tuesday, July 9, 1:30-4:45pm.

Advancing 2.5D and 3D Packaging through Value Engineering — Speakers from Altera, Amkor, ASE, ASET, KPMG, UMC, STATS ChipPAC and more will take a critical look at 2.5D implementations and the current outlook for 3D packages, including tools and technologies for heterogeneous stacks. Location: Moscone Center (North Hall), TechXPOT North, Wednesday, July 10, 1:00-3:30pm.

MEMS and Sensor Packaging for the Internet of Things — This session will feature speakers from all parts of the ecosystem to address how future visions of a pervasive interconnected world will be realized through the heterogeneous integration of MEMS and ICs. The program will feature keynote speaker Janusz Bryzek from Fairchild Semiconductor, and speakers from VTT Research, Fraunhofer IZM, Robert Bosche, EV Group, Dai Nippon Printing, and more.?Location: Moscone Center (North Hall), TechXPOT North, Thursday, July 11, 10:30am-1:00pm.

In addition to the packaging programs, SEMICON West will also present over 560 exhibitors with the latest innovation in microelectronics manufacturing, including over 150 exhibitors with equipment and technology solutions for advanced packaging. Other programs and exhibitors will address lithography, advanced materials and processes, silicon photonics, test, LED and MEMS manufacturing.

Contact: SEMI, 3081 Zanker Rd., San Jose, CA 95134 408-943-6900 fax: 408-943-7914 Web: or

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