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Archive >  July 2013 Issue >  Front Page News > 

City Councilor Journeys from Japan to "The Heart of Darkness"

Albuquerque, NM — When is a nuclear test not a nuclear test? That all depends on your viewpoint. Tests are performed in miniature by Sandia's Z machine — reportedly the most powerful laboratory producer of X-rays on Earth. The large accelerator regularly examines plutonium to study the fissile ...

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Semi North America Book-to-Bill Ratio Rises

San Jose, CA — North America-based manufacturers of semiconductor equipment posted $1.17 billion in orders worldwide in April 2013 (three-month average basis) and a book-to-bill ratio of 1.08, according to the April EMDS Book-to-Bill Report published by SEMI. A book-to-bill of 1.08 means that $108 worth of ...
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Onshoring Gets Huge Boost from Motorola


Ft. Worth, TX — In an unprecedented move that will probably draw many copycats, Google's Motorola has opened a large manufacturing plant in Ft. Worth, Texas, to manufacture the company's newest breed of smart phone, the Moto X. The facility is already up and running, doing pilot runs of small telephone ...
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Large-Scale Manufacturers Rely on Juki Compatibility

Morrisville, NC — High-volume manufacturing plants are using Juki equipment — specifically printers — for high visibility products, such as many of the Apple products that are made in Asia. The company's selective solder and stamp solder units are used by many automotive parts providers all ...

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European Space Agency approval for Ventec material in Amphenol Invotec rigid & flex-rigid production

Amphenol Invotec, one of Europe’s leading manufacturers of complex printed circuit boards (PCBs), and Ventec International, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, are delighted to announce that Ventec's VT-901 polyimide material is now fully qualified by ESA in Amphenol Invotec’s manufacturing process for rigid and Flex-rigid PCBs.


New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

DELAWARE, OH Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.


 
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