AYLESBURY, BUCKINGHAMSHIRE, UK —
Nordson DAGE, a division of Nordson Corporation is pleased to announce that its newly developed camera assist automation system will be exhibited in Booth 5971 at the SEMICON West exhibition scheduled to take place on 9-11th July 2013 in San Francisco, Calif.
Based upon a pedigree of automatic bond testing technology spanning more than two decades, Nordson DAGE has developed the latest camera assist automation as a feature of the award winning 4000Plus bondtester platform. Built around a unique multi-function cartridge, the camera assist automation system is ideally suited for applications such as pull and shear testing of wafer interconnections, lead frames, hybrid microcircuits or automotive electronic packages. Easy programming using fiducial camera assist and vector stage nudge buttons provides precise X-Y alignment and facilitates rapid changeover for a variety of bond testing applications.
In addition to the 4000Plus bondtester, Nordson DAGE will display its complete line of bond testing technology including the 4000HS high-strain. Nordson DAGE bond test technology meets the requirements of emerging test applications including ribbon pull, pad cratering using hot pin pull, bend and fatigue testing. The 4000Plus uses the next generation Paragon™ software providing semiautomatic test routines, automatic GR&R calculation, unique database search engine wizard and superior data reporting for unsurpassed data accuracy and repeatability.
Nordson DAGE also will launch a new bondtest platform at the SEMICON West show that is fully optimized for the specific demands of high-volume production bond testing.
About Nordson DAGE
Headquartered in Aylesbury, UK, Nordson DAGE is a unit of the Nordson Corporation and manufactures and supports a complete range of award winning digital X-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries. For more information, visit www.nordsondage.com.