GREELEY, CO —
FCT Assembly announces that it will exhibit at the upcoming SMTA Toronto Expo and Tech Forum, scheduled to take place Thursday May 16, 2013 at the Sheraton Toronto Airport Hotel & Conference Centre in Ontario. Keith Howell, Technical Director at Nihon Superior, will hold a technical presentation on nano silver replacement for high lead solders in semiconductor junctions. Keith works closely with the FCT Assembly team, a licensee for Nihon Superior’s SN100C.
FCT Assembly has developed the world’s most advanced stencil technology for solder paste printing. The technology is comprised of a specifically engineered nano coating applied over its proven Slic™ stencil. The technology is surprisingly cost-effective, making improved yields available to all levels of the industry. The technology can be used with current assembly equipment and processes.
The new NanoSlic™ stencil is based on the proven Slic™ stencil with its advanced foil composition and FCTA’s state-of-the-art laser cutting process. Then, a permanent nano coating is applied that is based on a revolutionary chemistry platform called Hybrid-T Technology™. The coating imparts a highly hydrophobic and oleophobic surface to the bottom of the stencil and aperture walls. The robust coating should last the life of the stencil.
Using the newly developed NanoSlic™ coating system, NanoSlic™ is sprayed onto the stencil surface and aperture walls, reducing bridging and significantly improving paste release, permitting consistent printing of the smallest area ratios. The technology will be applied by FCT Assembly in its various locations. The user will see following benefits immediately: reduced bridging, reduced underside cleaning, improved paste release and improved yields.
An added benefit, the NanoSlic™ coating, is environmentally friendly. It does not use any Perfluorooctanoic acid (PFOA), a toxic substance currently being investigated by the EPA.
For more information, visit www.fctassembly.com.