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Fujipoly Intros Low Viscosity Thermally Conductive Silicone
Thermally conductive silicone.
Carteret, NJ — Fujipoly has introduced SARCON
SPG-20A, an easy to dispense, low-viscosity thermally conductive silicone compound. When applied between a heat-generating component and a nearby heat sink or spreader, the very low compression, form-in-place material completely fills all unwanted gaps up to 3.0mm in height.
The form-stable thermal compound requires no heat curing, will not cause corrosion on metal surfaces, and maintains all initial properties across a wide temperature range of -40 to + 150°C. In addition, the new material provides a thermal conductivity of 2.0W/m°K with a thermal resistance of only 2.1°C cm
/W. The special physical properties of this silicone compound also allow for excellent vibration absorption and have proven to be an effective thermal solution for both current and emerging higher-frequency electronics applications.
Contact: Fujipoly America Corp., PO Box 119, Carteret, NJ 07008-0119
732-969-0100 fax: 732-969-3311 E-mail: email@example.com Web:
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