West Warwick, RI — Advanced Interconnections Corp. recently produced a video that shows how easy the Flip-Top BGA Socket is to use for device test and validation. The video illustrates how the socket's compact design uses less PC board space than typical test sockets because it requires no external screws, backing plates, or mounting holes in the PCB.
|Advanced BGA test socket. |
Highlighted features include the hinged clamp, with integral heat sink, which makes insertion and removal of devices quick and easy while ensuring a reliable connection. A chip support plate, customized to each specific IC package, allows for inconsistencies in package coplanarity, thickness, or tolerance issues to ensure a reliable electrical connection.
Contact: Advanced Interconnections Corp., 5 Energy Way, West Warwick, RI 02893 800-424-9850 or 401-823-5200 fax: 401-823-8723 E-mail: email@example.com Web: http://www.advanced.com or http://www.rtscomp.de