Sunday, May 29, 2016
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Donated Finetech Die Bonder Installed at Penn State U.
Srinivas Tadigadapa (left), Pennsylvania State University Professor, and Scott Kentner (right), Finetech Applications Engineer.
Tempe, AZ — A Fineplacer® Pico bonder has been installed at the MEMS Nanoscale and Devices Group at Pennsylvania State University. As part of the company's 20th anniversary last year, Finetech held a donation drawing for a $100,000 high-accuracy bonding system that was open to universities and colleges. This was Finetech's way of giving back to the university R&D segment of its business. Penn State was the randomly selected winner out of nearly 400 entries. With a wide installed base of systems at many prestigious institutions, Fineplacer die bonders provide an excellent solution for advanced technology environments utilizing diverse applications. The Pico bonder is an all-in-one platform for precise packaging and assembly applications, such as flip chip, optoelectronics, 3-D, wafer-level integration, micro-optics assembly, sensor packaging and precise die bonding.


Contact: Finetech, 8380 S. Kyrene, Ste. 110, Tempe, AZ 85284 480-893-1630 fax: 480-893-1632 E-mail: adrienne@finetechusa.com Web:
http://www.finetechusa.com

 
 
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