||Bannockburn, IL — IPC — Association Connecting Electronics Industries — has opened registration for the IPC/FED Conference on Embedded Components, a forum for designers, manufacturers, suppliers and end-users of embedded component technologies. The conference will be held June 4-5 at the Hotel InterContinental, Frankfurt, Germany. The event will provide access to industry experts who are advancing embedded component technology, from OEMs to fabricators to assemblers to designers.
"The IPC/FED Conference on Embedded Components is an excellent opportunity for every industry professional to get the latest information on reliability, test and assembly issues, as well as new manufacturing methods," said Sanjay Huprikar, IPC vice president, member success. "The conference is designed to maximize knowledge and networking for attendees who have an interest in the embedded component technology industry."
Conference session topics include an overview of embedded component technology in the present and in the future; the progress of embedded optical waveguides in PCBs; design and assembly process implementation for embedding passive and active components; embedding of passive and active components in a rigid-flex PCB; embedded ultra-thin chip packaging technology.
Presenters include industry leaders such as Jurgen Wolf, Wurth Elektronik; Happy Holden, Gentex; Andreas Osterman, Fraunhofer, IZM; Christian Rossle, Schweitzer Electronik AG; Sjef van Gastel and Patrick Huberts, Assembleon; Ralf Bruning, Zuken; Vern Solberg, Invensas; Michael Matthes, Wittenstein Electronics GmbH; Mike Morianz, Osterreich; Henry Potts, Mentor Graphics; Paul Wang, MiTac; Jan Vanfletern, IMEC; and Hemet Shah, Cadence Design Systems. Most presentations will be in English; however, English-German translation service is included in the cost of registration for all attendees.