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Combined 2D/3D Technology from Mirtec
MV-9 AOI system.
Estover, Plymouth, UK — Mirtec is highlighting its 2D/3D In-Line AOI Series configured with the company's exclusive OMNI-VISION® 3D Inspection Technology. This same system has won the Global Technology Award in both 2011 and 2012.

With the special combination of 2D inspection and 3D measurement with only one head, this system achieves the highest productivity and ultimate inspection performance, and false calls are avoided. With the 2D inspection, higher inspection speed, script and polarity detection are accomplished. The 3D measurement provides exact height and volume data.

The MV-9 utilizes a high resolution 15MP digital camera technology with telecentric lens and optional four 10MP side cameras (Side-Viewer®) for 3D inspection. This technology provides very special inspection performance and surpassing inspection speeds. The side cameras offer a spatial test and provide valuable information for a secure and reliable detection of side defects. Also, the check of complex components becomes quite easy.

The 3D check takes place with Multi-Frequency Moire analysis that also is used in the company's 3D solder paste inspection systems. This technology offers full 3D measurement of height, area, tilt, and lift. A projector projects grid patterns on the area that has to be measured. The camera saves the image and transfers the data to the machine. Subsequently, the software displays the measured, realistic 3D image.

All AOI systems from Mirtec with a minimum resolution of 10MP are standard equipped with the new 6-layer light system (RGB plus yellow light). This technology enables a full inspection of solder deposits and an enhanced detection of lifted leads.

Contact: Mirtec Corp., 3 Morse Rd. #2A, Oxford, CT 06478 203-881-5559 fax: 203-881-3322 Web:

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