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IPC Issues Call for Participation for 2014 IPC APEX EXPO

BANNOCKBURN, IL —  
IPC – Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders to submit abstracts for the 2014 IPC APEX EXPO® at the Mandalay Bay Resort and Convention Center in Las Vegas. The technical conference will be held March 25-27, 2014, and the professional development courses will be held March 23, 24 and 27, 2014.

           The world’s premier conference and exhibition for the electronic interconnect industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. To recognize exceptional achievement, awards will be presented for “Best U.S. Paper” for U.S. authors and “Best International Paper” for authors outside the United States.

           Expert presentations are being sought on design, materials, assembly, processes and equipment in the following areas:

  • Adhesives
  • Advanced Technology
  • Area Array/Flip Chip/0201
  • Assembly and Rework Processes
  • BGA Packaging
  • Black Pad and other Board Related Issues
  • Business & Supply Chain Issues
  • BTC/QFN/MLF
  • Conformal coatings
  • Counterfeit Electronics
  • Design
  • Electromigration
  • Electronics Manufacturing Services
  • Embedded Passive & Active Devices
  • Environmental Compliance
  • Flexible Circuitry
  • Head-in-Pillow, Component & Board Warpage
  • Lean Six Sigma
  • HDI Technologies
  • High Speed, High Frequency & Signal

Integrity

  • Lead Free Fabrication, Assembly & Reliability
  • Microminiaturization
  • Nanotechnology
  • Optoelectronics
  • Packaging & Components
  • PoP

 

  • PCB Fabrication
  • PCB and Component Storage & Handling
  • Performance, Quality & Reliability
  • Photovoltaics
  • Printed Electronics
  • RFID Circuitry
  • Soldering
  • Surface Finishes
  • Test, Inspection & AOI
  • Tin Whiskers
  • Underfills
  • Via Plugging & Other Protection
  • 2.5D/3D Packaging

           A 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain technical and/or appropriate test results. In addition, course proposals are solicited from individuals interested in presenting half-day professional development courses on design, manufacturing processes and materials. Reimbursement for travel expenses and an honorarium are offered to course instructors.

           Both the technical conference paper abstracts and course proposals are due May 4, 2013. To submit an abstract or proposal, visit www.IPCAPEXEXPO.org/CFP.

           For more information about conference presentations, contact Jasbir Bath, IPC conference director, at JasbirBath@ipc.org or Toya Richardson, IPC technical programs coordinator, at ToyaRichardson@ipc.org.

           For more information about half-day professional development courses, contact Susan Filz, IPC director of industry programs and professional development, at SusanFilz@ipc.org.

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