BANNOCKBURN, IL —
More than 60 technical papers addressing critical issues in specialized design, packaging, assembly and surface mount will anchor the technical conference at IPC Electronic System Technologies Conference and Exhibition (IPC ESTC), May 20–23, in Las Vegas. Featuring new research from experts around the world, the technical conference at IPC ESTC boasts 13 tracks designed to help the entire electronics industry supply chain gain efficiencies and boost quality in all phases of the product lifecycle.
“The quality and variety of papers for the inaugural technical conference is truly impressive,” says Sanjay Huprikar, IPC vice president of member success. “Our goal was to present new information for professionals in every area of the electronic product lifecycle and supply chain, and the industry responded with a number of excellent papers.”
Over two-and-a-half days, more than 60 research papers will be presented in the areas of product design and development; assembly and SMT; PCB fabrication, materials and design; quality and reliability; fabrication and silicon; test; equipment, tools and modules; packaging and substrates; mechanics; thermals; electrical; materials; and industry analysis and issues.
In addition to the technical conference, IPC ESTC will offer eight keynote presentations; an array of professional development courses; an exhibition; networking receptions; luncheons; and standards development meetings.
IPC ESTC is a new event that targets the entire electronics industry — from product design and analyses through component packaging and printed board assembly to complete systems — to create a new framework for technology interchange and innovation.
More information about IPC ESTC is available at www.ipc.org/ESTC. For registration options, visit www.ipc.org/ESTC-register. Access to the exhibit hall is free to pre-registrants, a savings of $25. Individuals who register by April 26 can save $100 on a technical conference registration.