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Senior VP of Amkor Technology to Deliver IPC ESTC Keynote on Achieving Exceptional Package Design

BANNOCKBURN, IL —  
Over the last few years, rival packaging technologies system-on-chip (SoC) and system-in-package (SiP) have converged, leading to the evolution of micro-EMS, a module level packaging that integrates the functional aspects of both SiP and SoC. Presenting the common applications and uses of these packaging types, Dr. Choon Lee, senior vice president, Amkor Technology, and a leading expert and innovator in the field of packaging technology, will reveal their strengths and weaknesses during his keynote, “System Integration Challenges in Packaging,” at
IPC Electronic System Technologies Conference & Exhibition (ESTC), on May 22, 2013.

           In addition to covering the benefits and limitations of packaging types for major market segments, Dr. Lee will discuss simulation and modeling tools that are providing developers with unique insights to shorten overall development times. Moreover, he will divulge how Amkor’s holistic approach — looking at the totality of a product’s life cycle, from initial design through manufacturing and tests — is addressing challenges throughout system development.

           IPC ESTC will also offer seven additional keynote presentations featuring leading industry experts from Cadence Design Systems, Intel Corporation, Lenovo, Medtronic, Microsoft, Multitest Elektronische Systeme GmbH and STATS ChipPAC, who will provide valuable insights into all arenas of system technologies.

More information on IPC ESTC is available at www.ipc.org/ESTC. For registration options, visit www.ipc.org/ESTC-register. Access to the exhibit hall is free to pre-registrants, a savings of $25 on-site. Individuals who register by April 26 can save $100 on a technical conference registration.

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