JENA, Germany -
At the SMT/Hybrid/Packaging show in Nuremberg/Germany GOEPEL electronic will demonstrate its uniqueness as the world’s only company providing electronic and optical test and inspection equipment as a one-stop-shop. The company’s AOI, 3D AXI and 3D SPI systems as well as the wide range of JTAG/Boundary Scan test, programming and emulation tools represent technologically leading solutions in their respective market segments.
In hall 6 at stand 410, several innovations and news from GOEPEL electronic’s product divisions will be found:
The OptiCon THT-Line AOI system now features two matrix cameras to be utilized for parallel inspection of the PCB top and bottom sides. The simultaneous THT component and solder joint inspection results in the shortest cycle times in production lines.
The OptiCon TurboLine system has been upgraded for double-sided AOI of SMD assemblies – alleviating the need for two separate AOI systems and a turning station. The system also supports inspection of pin-in-paste (THR) or selective solder joints, e.g. at connectors.
An extended XL version of GOEPEL electronic’s Boundary Scan inline programmer RAPIDO will be introduced for the first time. RPS3000-S32XL can be utilized for parallel in-system programming and test of up to 32 assemblies, providing a number of new features. A special characteristic is the support of board dimensions up to 500 mm X 500 mm.
Various new Embedded System Access (ESA) technologies such as Chip Embedded Instruments based on GOEPEL electronic’s ChipVORX® methodology, their parallel operations on several UUTs for throughput increase and much more await the interested visitors.
A special highlight is the market introduction of a new test type named “Interactive ATE” for MDA and In-Circuit test systems. This particular development enables interactive tests between Boundary Scan equipment and ATE system, with the power to execute the interaction not only for hybrid or multiplexed but also purely analogue pin cards.
Further development in the fields of Automated X-Ray Inspection (AXI) and Solder Paste Inspection (SPI) round out GOEPEL electronic’s show appearance. The 3D systems OptiCon X-Line 3D and OptiCon SPI-Line 3D have been representing the technological leading edge in their markets, offering customer benefits particularly in the areas of inspection safety, speed and handling.
Further information about the company and its products can be found on the internet at www.goepel.com.