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Archive >  March 2013 Issue >  Hi-Tech Events > 

SMT Hybrid Packaging in Nuremberg
Nuremberg, Germany — The SMT Hybrid Packaging Conference, Tutorials and Workshop is set to run April 16-18 at the Nuremberg Exhibition Centre, Nuremberg, Germany.

In addition to the exhibition, the SMT Hybrid Packaging conference and tutorials are the most important platform for information and networking in the field of micro electronics manufacturing in Europe.

The program consists of a high-class, user-oriented conference day in German, which deals with current issues. In addition, a large number of practice-oriented half-day tutorials in German and English offer information and first-hand results.

International experts from industry and science will present current and future developments in electronics manufacturing, offer solutions for special problems. All delegates are invited to discuss and to exchange their experiences.


Contact: Kallman Associates, Inc., 20 Harrison Avenue, Waldwick, NJ 07463-1709 201-652-7070 fax: 201-652-3898 E-mail jerry@kallmanexpo.co

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