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ARCHIVE >  March 2013 Issue >  Electronic Mfg. Services > 

Considerations for Reduced Cost Micro Array Component Rework


Micro ball grid array packages (µBGA) rapidly are becoming the package of choice when designing new printed circuit board (PCB) assemblies. These packages generally offer high, first-pass process yields with significant real estate savings over their predecessors. Process or design ...

Creativity Fuels Increase in Sales For IMET


Not many chief executives can claim their company's sales have quadrupled over the past four years. One of the select few that can is Tom Krol, President of IMET Corporation, a multi-faceted electronics design and production firm in Southampton, PA.

Partnering to Better Provide TTC Solutions to the Industry


Cogiscan partners with leading equipment manufacturers and electronics assemblers to create solutions that can integrate with existing systems to provide factory-wide Trace, Trace and Control (TTC) solutions. The company is committed to the development and continuous improvement of ...

 
 
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