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Archive >  March 2013 Issue >  Front Page News > 

March '13: Juki Celebrates 75 Years of Global Innovation and Quality


Juki Corporation was founded in December 1938 when approximately 900 machinery manufacturers in Tokyo invested in the corporation and commenced operation under the corporate name: "TOKYO JUKI MANUFACTURERS ASSOCIATION." Juki focused on sewing machine technology as well as surface ...

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World's Largest Fiber Optic Network at Sandia

Albuquerque, NM — Sandia National Laboratories has become a pioneer in large-scale passive optical networks, building the largest fiber optical local area network in the world. The network pulls together 265 buildings and 13,000 computer network ports and brings high-speed communication to some of ...
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New Board-Level Photonics Materials

San Francisco, CA — A major step in photonics, using a new type of polymer material to transmit light instead of electrical signals within supercomputers and data centers has been jointly unveiled by Dow Corning and IBM scientists. The new silicone-based material offers better physical properties ...

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KYZEN Climbs to New Heights
On November 2, 2017, KYZEN Employee TC Loy finally began his long-awaited quest to climb Mount Everest. After two years of preparation and delays due to Mother Nature, TC and a group of friends set out for Lukla, located in Northeastern Nepal, where locals welcomed them to the Himalayas (near Mount Everest) to begin their journey. 
Nano Global, Arm Collaborate on Artificial Intelligence Chip to Drive Health Revolution by Capturing and Analyzing Molecular Data in Real Time
AUSTIN, TX - Nano Global, an Austin-based molecular data company, today announced that it is developing a chip using intellectual property (IP) from Arm, the world’s leading semiconductor IP company. The technology will help redefine how global health challenges - from superbugs to infectious diseases, and cancer are conquered.
ClassOne Slashes Via Liner Plating Costs for Compound Semi
KALISPELL, MT - ClassOne Technology (classone.com), manufacturer of Solstice® plating systems for ≤200mm wafers, announced a new plating technique that provides significant cost reductions for compound semiconductor manufacturers who use gold plated vias.

"We have compound semiconductor customers that use gold for via liners who are switching to copper to save money," said Kevin Witt, President of ClassOne Technology.

 
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