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Archive >  March 2013 Issue >  Front Page News > 

March '13: Juki Celebrates 75 Years of Global Innovation and Quality


Juki Corporation was founded in December 1938 when approximately 900 machinery manufacturers in Tokyo invested in the corporation and commenced operation under the corporate name: "TOKYO JUKI MANUFACTURERS ASSOCIATION." Juki focused on sewing machine technology as well as surface ...

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World's Largest Fiber Optic Network at Sandia

Albuquerque, NM — Sandia National Laboratories has become a pioneer in large-scale passive optical networks, building the largest fiber optical local area network in the world. The network pulls together 265 buildings and 13,000 computer network ports and brings high-speed communication to some of ...
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New Board-Level Photonics Materials

San Francisco, CA — A major step in photonics, using a new type of polymer material to transmit light instead of electrical signals within supercomputers and data centers has been jointly unveiled by Dow Corning and IBM scientists. The new silicone-based material offers better physical properties ...

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SMTA Europe's Harsh Environments Conference Session 7 to Focus on Hi-Temp Mats/Fab
SMTA Europe announces Session 7 Technical Program on High Temperature PCB Materials and Fabrication at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.      
EOS WLC550 series offers maximum Cooling Flexibility on Standard Footprint
Last week at the MT-CONNECT in Nuremberg more than 150 companies from the European MedTec Business met for discussing the latest trends and guidelines in MedTec industry. When EOS power presented its medical up to class-2 powersupplies at MT-CONNECT, the EOS team made an exciting observation: While everyone is still talking about the size of the powersupplies, which is still very true for home devices, the real crucial factor for sales support for larger devices at the MT connect was the cooling.   
SEMI and TechSearch International Report Global Semiconductor Packaging Materials Market Reaches $16.7 Billion

MILPITAS, CA SEMI, the industry association representing the global electronics manufacturing supply chain, and TechSearch International today reported that the global semiconductor packaging materials market reached $16.7 billion in 2017. While slower growth of smartphones and personal computers – the industry’s traditional drivers – is reducing material consumption, the slowdown was offset by strong unit growth in the cryptocurrency market in 2017 and early 2018. Flip chip package shipments into the cryptocurrency market, while providing a windfall to many suppliers, are not expected to remain at high levels.  


C&K ANNOUNCES THAT IT HAS ACQUIRED VUILLERMOZ
Newton, MA – C&K, one of the world’s most trusted brands of high-quality electromechanical switches, today announces that it has acquired the company Vuillermoz, a micro-mechanical components and tooling company located in St. Claude, France.



 
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