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Archive >  March 2013 Issue >  Front Page News > 

March '13: Juki Celebrates 75 Years of Global Innovation and Quality


Juki Corporation was founded in December 1938 when approximately 900 machinery manufacturers in Tokyo invested in the corporation and commenced operation under the corporate name: "TOKYO JUKI MANUFACTURERS ASSOCIATION." Juki focused on sewing machine technology as well as surface ...

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World's Largest Fiber Optic Network at Sandia

Albuquerque, NM — Sandia National Laboratories has become a pioneer in large-scale passive optical networks, building the largest fiber optical local area network in the world. The network pulls together 265 buildings and 13,000 computer network ports and brings high-speed communication to some of ...
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New Board-Level Photonics Materials

San Francisco, CA — A major step in photonics, using a new type of polymer material to transmit light instead of electrical signals within supercomputers and data centers has been jointly unveiled by Dow Corning and IBM scientists. The new silicone-based material offers better physical properties ...

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SEMI: North American Semiconductor Equipment Industry Posts November 2017 Billings
MILPITAS, CA - North America-based manufacturers of semiconductor equipment posted $2.05 billion in billings worldwide in November 2017 (three-month average basis), according to the November Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. 
Avnet Sponsors The Not Impossible Awards Recognizing Emerging Technologies that Improve Lives
Avnet, a leading global technology distributor, today announced its title sponsorship of The Not Impossible Awards, which recognizes the breakthrough achievements of innovators who share the Not Impossible Labs mission to create inventive technology that improves the well-being of others. 
aveniĀ® S.A. Extends Copper Interconnects to 5nm and Below for BEOL Integration Using Innovative Electroplating Chemistry
MASSY, France - aveni S.A., developer and manufacturer of market-disrupting wet deposition technologies and chemistries for 2D interconnects and 3D through silicon via packaging, today announced it has obtained results that strongly support the continued use of copper in the back end of line (BEOL) for advanced interconnects, at and beyond the 5nm technology node. 
Kilopass NVM OTP IP Achieves 3-Lot Qualification on GLOBALFOUNDRIES 14nm LPP (Low Power Process) Process Technology
SAN JOSE, CA - Kilopass Technology Inc., a leading provider of semiconductor logic embedded non-volatile memory (eNVM) intellectual property (IP), today announced that it successfully achieved a three-lot qualification on GLOBALFOUNDRIES (GF) 14nm LPP (Low Power Process) technology platform for its one-time programmable (OTP) NVM technology. 
 
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