Thursday, April 26, 2018
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Donated Finetech Die Bonder Installed at Pennsylvania State University
 Left to right: Srinivas Tadigadapa, Pennsylvania State University Professor, and Scott Kentner, Finetech Applications Engineer
A FINEPLACER® Pico bonder has been installed at the MEMS Nanoscale and Devices Group at Pennsylvania State University. As part of the company’s 20th anniversary last year, Finetech held a donation drawing for a $100,000 high-accuracy bonding system that was open to universities and colleges. This was Finetech’s way of giving back to the university R&D segment of its business. Penn State was the randomly selected winner out of nearly 400 entries.

“We have been using the Pico bonder for a couple of months now and are pleased to have added high-accuracy bonding capabilities to our facility,” states Srinivas Tadigadapa, Pennsylvania State University, Professor, College of Engineering MEMS Nanoscale and Devices Group. “We are able to use it for our MEMS device packaging, microfluidic devices and laser diode devices research. The students particularly like the user interface of the machine and appreciate the high accuracy placement of aligned dies.”

With a wide installed base of systems at many prestigious institutions, FINEPLACER® die bonders provide an ideal solution for advanced technology environments utilizing diverse applications. The FINEPLACER® Pico bonder is an ‘all-in-one’ platform for precise packaging and assembly applications, such as flip chip, optoelectronics, 3-D, wafer-level integration, micro-optics assembly, sensor packaging and precise die bonding.

For more information about Finetech, visit

For more information about the MEMS Nanoscale and Devices Group, visit

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