MILPITAS, CA —
Flex Interconnect Technologies (FIT), a leader in design, manufacture and assembly of flexible printed circuits, announces that it will exhibit in booth #438 at the AeroDef Manufacturing exhibition and conference, scheduled to take place March 19-21, 2013 at the Long Beach Convention Center in California.
FIT will exhibit both its custom flex solution as well as its new high-speed standard DATA LINK flex cable lines with Samtec connectors. The high-speed cables are standard stock items, but also can be customized to fit specific customer needs.
In addition to ISO: 2008, AS9100 rev C and UL certifications FIT is ITAR registered. All manufacturing for FIT is completed in the United States and the company continues to contribute to rebuilding the American economy.
Flex Interconnect Technologies provides complete engineering support, design layout, quick-turn prototypes, volume production and turnkey assembly. For more information, stop by booth #438 at the AeroDef Manufacturing exhibition and conference or visit www.fit4flex.com.