SPOKANE VALLEY, WA –
ACE Production Technologies, a leading provider of Selective Soldering systems and lead-tinning services, announces the introduction and availability of the LTS 300, an automated molten hot dip solder lead tinning system for reconditioning all T/Hole, SMT and QFP components, and to ensure their compliance with RoHs and Hi-Rel requirements.
In making the announcement, Alan Cable, President, said, “The new LTS 300 actually combines three (3) essential tinning processes in one machine; it performs a Dip process for through-hole components, a Drag process for chips and LCCs, and is equipped with a vacuum-articulated spindle for tinning QFP leads. It’s flexible, fast, repeatable, and ideal for the full range of tinning applications.”
These applications include refurbishing “Legacy Components” (removing the oxidized (plated) lead finish and re-placing with a fused intermetalic Sn/Pb finish); Gold Embrittlement mitigation, i.e., removing the gold from the component leads by “solubilizing” in molten Sn/Pb solder; Tin whisker mitigation (replacing tin plating with fused alloy); Converting RoHS components to Sn/Pb and vice-versa; Solderability Testing (IPC/EIA J-STD-001 and ANSI-GEIA-STD-0006); and BGA cleansing, i.e., removing excess solder from extracted BGAs without cumbersome wicking or solder suckers.
The LTS 300 employs a “DIP” process for T/H components, using a Flat wave solder nozzle, working in conjunction with pallets that hold the components in position through the process. Under program control, a pallet of components moves to the flux station followed by preheating, then to the first solder pot (scavenging pot) to remove the existing coating. While immersed in the solder, a side to side motion provides a “scrubbing” action to help in dissolving the unwanted plating into the “scavenging” alloy. The pallet returns to the flux station where the leads are once again fluxed then conveyed to the second solder pot for the final homogenous intermetalic coating.
The LTS 300 also employs a “Drag” process for chips, LCCs, MELFs using a cascading solder nozzle. Components are pulled through a solder wave in a programmed and controlled manner, and as they escape the wave, the downward flow of solder draws off excess solder leaving the pads on LCCs co-planer and chip terminations within dimensional specifications.
The QFP tinning process for fine pitch QFPs employs a side wave solder nozzle in a configuration that immerses the leads into a Side Wave to dissolve and remove the initial coating and then provide a final alloy coating. More information, including data sheets and a comprehensive video of the various tinning processes, can be obtained by contacting ACE at www.ace-protech.com.