CARLSBAD, CA -
Nordson YESTECH, a leading supplier of automated optical and x-ray inspection systems for the electronics industry, will feature the new high speed FX SL advanced AOI inspection system for populated printed circuit boards, at the annual APEX 2013 show. Held at the San Diego Convention Center, in San Diego, California from February 19th to the 21st, they will conduct live demonstrations in the booth of their complete line of AOI and AXI inspection systems.
Nordson YESTECH’s FX SL AOI offers accelerated throughput at over twice the inspection speed of previous generation systems without compromising defect coverage or low false failure rates. Significant speed gains are realized at all currently available system magnifications of 8, 12, and 25 microns/pixel. The FX SL AOI is the result of over 20 years of industry experience from the technical team at Nordson YESTECH and utilizes a flexible and comprehensive set of inspection tools such as angled cameras, 3D height sensor, advanced Fusion Lighting™, full color digital image processing technology, and both image-based and rule-based algorithms.
Programming is also fast and easy, with operators typically taking less than 1 hour to create a complete inspection program, including solder inspection. The FX SL AOI is equally well suited for high-volume and high mix manufacturing environments, providing fast throughput and high resolution, and capable of inspecting 01005 components. The system utilizes a standard package library to simplify training and insure program portability across manufacturing lines.
The FX SL saves valuable inspection time, delivering a complete, high-speed automated inspection of solder and lead defects, component presence and position, correct part, polarity and through-hole parts featuring:
· Capture on the fly technology
· 5 megapixel color imaging
· 1 top-down and 4 side angle cameras
· Quick set-up
· High speed, high defect coverage
· Low false failure rate
Configurable for all line positions, the FX SL is equally effective for paste, pre / post-reflow and final assembly inspection. Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.
“We are very pleased to once again be exhibiting our latest inspection solutions at APEX 2013,” said Don Miller, Nordson YESTECH President. “APEX is the ideal opportunity to meet with our valued customers and demonstrate YESTECH’s latest advancements in AOI. The FX SL is an exceptional system and we look forward to discussing the many benefits with our clients at the show.”
For pricing and availability call Nordson YESTECH's USA HQ at: 760-918-8471 or visit the Nordson YESTECH website at http://www.nordsonyestech.com
See at APEX Booth 2919