|COLORADO SPRINGS, CO –
Photo Stencil, LLC, a leading full-service provider of high-performance stencils and tooling, will present the papers, Printing and Assembly Challenges for QFN Devices and Two Print Stencils Process at IPC APEX 2013.
The two print stencils process is a useful tool in SMT assembly and package assembly. The concept is to print with a first print stencil which is thinner than the second print stencil. The second print stencil has relief pockets formed anywhere that the first stencil printed. Applications include printing solder paste for through-hole and SMT, glue and solder paste, flux and solder paste, solder paste for SMT and RF shields, reservoir solder paste for multi-level boards, and solder paste and reservoir flux. The paper will be presented by Dr. William Coleman, Ph.D, Wednesday, February 20, 2013, from 9:00–10:00 AM during Session S27 Printing I.
Printing and Assembly Challenges for QFN Devices addresses the assembly challenges in dealing with ground plane design, such as package floating, aperture design, stencil selection, and repair, of QFN (quad flatpack no leads) and DFN (dual flatpack no leads) devices. Aperture design considerations cover solder mask designs including SMD, NSMD, and NSMD window as well as area ratio considerations and stencil technology solutions. The paper will be presented by Rachel Miller-Short on Thursday, February 21, 2013 from 10:15 AM–12:00 PM during Session S32, Printing II.
In addition, Dr. Coleman will present a poster session on printing and assembly challenges for QFN on Wednesday, February 20, from 3:30–4:30 PM.
Photo Stencil will be exhibiting at IPC APEX, San Diego, CA, from January 19-21, 2013, at booth #1215. Both presenters and the Photo Stencil team of engineers will be available to discuss your printing challenges. For more information, or to arrange an appointment, contact Photo Stencil at firstname.lastname@example.org or visit the Photo Stencil website at http://www.photostencil.com/apex2013.php